Tongwei Co., Ltd. (stock code: 600438) completed the issuance of its 2026 fifth green science and technology innovation bond on July 14, 2026, with the raised funds fully received on the same day.
The bond, abbreviated as '26 Tongwei GN005 (Sci-Tech Innovation Bond)', has the code 132680080. It features a 1+1 year term, with an interest accrual date of July 14, 2026, and a maturity date of July 14, 2028. The actual total issuance amount was RMB500 million, consistent with the planned size. The issue price was 100 per 100 yuan face value, and the coupon rate was 2.20%.
The lead underwriters for this issuance were China CITIC Bank Corporation Limited and China Merchants Bank Co., Ltd., while Tianjin Bank Co., Ltd. served as the joint lead underwriter.
The company had previously obtained registration for debt financing instruments from the National Association of Financial Market Institutional Investors, effective for two years from April 28, 2025, allowing for multiple tranche issuances of various products. This bond issuance was conducted under that registration framework. Relevant issuance documents have been published on the China Money website and the Shanghai Clearing House website.